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Bonding Film - List of Manufacturers, Suppliers, Companies and Products

Bonding Film Product List

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Low dielectric bonding film AlonMighty AF-700 series

Low dielectric bonding film AlonMighty AF-700 series

Excellent low dielectric properties and adhesion. For bonding high-speed transmission substrate materials such as mobile FPCs, including smartphones.

The "Aromite AF-700 Series" is a thermosetting bonding film that boasts industry-leading low dielectric constant and low dielectric loss tangent. It effectively suppresses transmission loss in high-frequency ranges, making it suitable for electronic material applications. It is used in bonding high-speed transmission substrate materials, such as flexible printed circuit boards (FPC) for mobile devices, including smartphones. It demonstrates excellent adhesion to difficult-to-bond substrates like polyimide and LCP, and offers good processability in FPC manufacturing. Customization is available upon request. 【Features】 ■ Low water absorption rate, maintaining high adhesive strength even in humid heat environments ■ Suitable as a bonding film for multilayer FPCs and adhesive layers for FCCL and coverlay ■ Also adopted for automotive millimeter-wave radar and antenna materials for base stations *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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Conductive bonding film + bonding with SUS

Conductive bonding film + bonding with SUS

Conductive bonding film + SUS material allows external extraction of FPC's GND.

Conductive bonding films have adhesive layers that possess conductivity, which provides features such as wide-band shielding characteristics, stable electrical connections, and adhesion to various substrates. Therefore, when bonding a reinforcing plate to an FPC that involves component mounting, such as in camera modules, it is possible to impart shielding performance. Additionally, using metal reinforcing plates like SUS allows for electrical connection between the FPC's GND circuit and the metal reinforcing plate, thereby providing shielding performance. Meisei Electric has extensive experience in processing thermosetting conductive bonding films and SUS. The bonding of the bonding film and SUS can be done neatly using our in-house vacuum press machine, where we can control the temperature, vacuum time, pressure force, and duration. Furthermore, after bonding, circuit formation is possible through punching processing with the press machine. For tape processing products, we can propose optimal processes and methods tailored to your requirements, such as work size and product arrangement, which can lead to reduced processing time for customers and provide cost benefits. If you have any interest or inquiries, please feel free to contact us.

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[Research Material] The Global Market for Dicing Die Bonding Film

[Research Material] The Global Market for Dicing Die Bonding Film

Global Market for Dicing Die Bonding Film: UV Curing, General, Chip-to-Chip, Chip-to-Substrate, Others

This research report (Global Dicing Die Bonding Films Market) investigates and analyzes the current status and outlook for the global market of dicing die bonding films over the next five years. It includes information on the overview of the global dicing die bonding films market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the dicing die bonding film market focus on UV curing and general types, while the segments by application target chip-to-chip, chip-to-substrate, and others. The regional segments calculate the market size of dicing die bonding films by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the dicing die bonding film sector, product and business overviews, and sales performance.

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